Memory Having a Layer with Electrical Conductivity Anisotropy

ABSTRACT

A data storage device comprises a media including a memory layer within which are formable domains associated with information, and a conductive layer disposed over the memory layer, the conductive layer having anisotropically increased electrical conductivity in a thickness direction. A conductive tip contactable with the conductive layer is adapted to form domains within the memory layer and one of the conductive tip and the media is movable to access the memory layer.

PRIORITY CLAIM

This application is a continuation of pending U.S. patent applicationSer. No. 11/003,953, entitled “Systems for Writing and Reading HighlyResolved Domains for High Density Data Storage,” (Attorney Docket NO.NANO-01024US2), filed Dec. 3, 2004, which claims priority to U.S.Provisional Patent Application No. 60/563,123, entitled “SuperResolution Writing and Reading for High Density Data Storage,” (AttorneyDocket No. NANO-01024US0), filed Apr. 16, 2004.

COPYRIGHT NOTICE

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to the facsimile reproduction by anyone of the patent documentor the patent disclosure, as it appears in the Patent and TrademarkOffice patent file or records, but otherwise reserves all copyrightrights whatsoever.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

This application incorporates by reference all of the followingco-pending applications and the following issued patent:

U.S. patent application Ser. No. 10/684,883, entitled “Molecular MemoryIntegrated Circuit Utilizing Non-Vibrating Cantilevers,” Attorney DocketNo. LAZE-01011US1, filed Oct. 14, 2003;

U.S. patent application Ser. No. 10/684,661, entitled “Atomic Probes andMedia for high Density Data Storage,” Attorney Docket No. LAZE-01014US1,filed Oct. 14, 2003;

U.S. patent application Ser. No. 10/684,760, entitled “Fault TolerantMicro-Electro Mechanical Actuators,” Attorney Docket No. LAZE-01015US1,filed Oct. 14, 2003;

U.S. patent application Ser. No. 10/685,045, entitled “Phase ChangeMedia for High Density Data Storage,” Attorney Docket No. LAZE-01019US1,filed Oct. 14, 2003;

U.S. Provisional Patent Application No. 60/418,616 entitled “MolecularMemory Integrated Circuit Utilizing Non-Vibrating Cantilevers,” AttorneyDocket No. LAZE-01011US0, filed Oct. 15, 2002;

U.S. Provisional Patent Application No. 60/418,923 entitled “AtomicProbes and Media for High Density Data Storage,” Attorney Docket No.LAZE-01014US0, filed Oct. 15, 2002;

U.S. Provisional Patent Application No. 60/418,612 entitled “FaultTolerant Micro-Electro Mechanical Actuators,” Attorney Docket No.LAZE-01015US0, filed Oct. 15, 2002;

U.S. Provisional Patent Application No. 60/418,618 entitled “MolecularMemory Integrated Circuit,” Attorney Docket No. LAZE-01016US0, filedOct. 15, 2002;

U.S. Provisional Patent Application No. 60/418,619 entitled “PhaseChange Media for High Density Data Storage,” Attorney Docket No.LAZE-01019US0, filed Oct. 15, 2002;

U.S. Patent Application No. 09/465,592, entitled “Molecular MemoryMedium and Molecular Memory Integrated Circuit,” Attorney Docket No.LAZE-01000US1, filed Dec. 17,1999; and

U.S. Pat. No. 5,453,970, entitled “Molecular Memory Medium and MolecularMemory Disk Drive for Storing Information Using a Tunnelling Probe,”issued Sep. 26, 1995 to Rust, et al.

TECHNICAL FIELD

This invention relates to high density data storage using molecularmemory integrated circuits.

BACKGROUND

In 1965, Gordon Moore observed an exponential growth in the number oftransistors in an integrated circuit and predicted that the trend wouldcontinue- and it has. Software developers have pushed each generation ofintegrated circuit to the limits of its capability, developing steadilymore data intensive applications, such as ever-more sophisticated, andgraphic intensive applications and operating systems (OS). Eachgeneration of application or OS always seems to earn the derisive labelin computing circles of being “a memory hog.” Higher capacity datastorage, both volatile and non-volatile, has been in persistent demandfor storing code for such applications. Add to this need for volume theconfluence of personal computing and consumer electronics in the form ofpersonal MP3 players, such as the iPod, personal digital assistants(PDAs), sophisticated mobile phones, and laptop computers, which hasplaced a premium on compactness and reliability.

Nearly every personal computer and server in use today contains one ormore hard disk drives for permanently storing frequently accessed data.Every mainframe and supercomputer is connected to hundreds of hard diskdrives. Consumer electronic goods ranging from camcorders to TiVo® usehard disk drives. While hard disk drives store large amounts of data,they consume a great deal of power, require long access times, andrequire “spin-up” time on power-up. FLASH memory is a more readilyaccessible form of data storage and a solid-state solution to the lagtime and high power consumption problems inherent in hard disk drives.Like hard disk drives, FLASH memory can store data in a non-volatilefashion, but the cost per megabyte is dramatically higher than the costper megabyte of an equivalent amount of space on a hard disk drive, andis therefore sparingly used.

Phase change media are used in the data storage industry as analternative to traditional recording devices such as magnetic recorders(tape recorders and hard disk drives) and solid state transistors(EEPROM and FLASH). CD-RW data storage discs and recording drives usephase change technology to enable write-erase capability on a compactdisc-style media format. CD-RWs take advantage of changes in opticalproperties (e.g., reflectivity) when phase change material is heated toinduce a phase change from a crystalline state to an amorphous state. A“bit” is read when the phase change material subsequently passes under alaser, the reflection of which is dependent on the optical properties ofthe material. Unfortunately, current technology is limited by thewavelength of the laser, and does not enable the very high densitiesrequired for use in today's high capacity portable electronics andtomorrow's next generation technology such as systems-on-a-chip andmicro-electric mechanical systems (MEMs). Consequently, there is a needfor solutions which permit higher density data storage, while stillproviding the flexibility of current phase change media solutions.

BRIEF DESCRIPTION OF THE DRAWINGS

Further details of the present invention are explained with the help ofthe attached drawings in which:

FIG. 1A is an exemplary die for use with an embodiment of the presentinvention including sixteen cells, each cell having a tip platformcomprising sixteen tips.

FIG. 1B is a cell of the exemplary die of FIG. 1A.

FIG. 1C is an embodiment of a platform in accordance with the presentinvention including a sub-platform associated with a main platform,wherein a cantilever is connected with the sub-platform.

FIG. 1D is a schematic showing hypothetical thermal expansion of fourplatforms within four cells.

FIG. 1E is a schematic showing hypothetical thermal expansion of asingle platform having a size similar to that of the four cells.

FIG. 2 is a cross-section of a film stack for use in forming ultra-sharptips for use in the exemplary die of FIG. 1B.

FIG. 3A is an exemplary media die corresponding to the exemplary die ofFIG. 1A for use with an embodiment of the present invention, the mediadie including sixteen cells, each cell having a media platformcomprising sixteen media devices.

FIG. 3B is a cell of the exemplary media die of FIG. 3A.

FIG. 4A is a cross-section of a media device in accordance with anembodiment of the present invention in an unwritten state.

FIG. 4B is a cross-section of the media device of FIG. 4A including adata bit written to a phase change layer of the media device.

FIG. 5 is a phase change chart of an exemplary phase change material foruse with systems and methods in accordance with the present invention.

FIG. 6 illustrates heating characteristics of the media device of FIGS.4A and 4B.

FIG. 7A is a top view, grayscale map of a sequence of bits written to aportion of a media device including a corresponding write waveform.

FIG. 7B is a top view, grayscale map of the sequence of bits of FIG. 7Aincluding a corresponding analog read data signal and a digitalconversion of the analog read data signal.

FIG. 7C is a top view, grayscale map of an erase sequence to erase thesequence of bits of FIGS. 7A and 7B, including a corresponding writewaveform.

FIG. 8 is a circuit diagram of a read/write circuit in accordance withan embodiment of the present invention.

FIG. 9 is a circuit diagram of a read/write circuit in accordance withan alternative embodiment of the present invention.

FIG. 10 is a circuit diagram of a read/write circuit in accordance withstill another embodiment of the present invention including a pluralityof active media regions.

FIG. 11 is a circuit diagram of a read/write circuit in accordance withstill another embodiment of the present invention including a pluralityof active media regions.

FIG. 12 is a circuit diagram of a read/write circuit in accordance withstill another embodiment of the present invention including a pluralityof active media regions and a processing element.

FIG. 13 is a circuit diagram of an active media platform in accordancewith an embodiment of the present invention.

FIG. 14 is a circuit diagram of a die in accordance with an embodimentof the present invention having a plurality of the active mediaplatforms of FIG. 13.

FIG. 15 is a circuit diagram of an active media platform in accordancewith an alternative embodiment of the present invention, the activemedia platform including a plurality of dead spots.

FIG. 16 is a circuit diagram of a die in accordance with an embodimentof the present invention having a plurality of the active mediaplatforms of FIG. 15.

DETAILED DESCRIPTION

Read/Write Ead/Write Engine for Froming Indicia in a Media

FIGS. 1A and 1B illustrate an exemplary die 100 and an exemplary cell118 from the exemplary die 100 for use with systems and methods inaccordance with the present invention. The die 100 comprises sixteencells 118, each cell 118 including a tip platform 108 on which sixteencantilevers 112 are connected. The platform 108 is made positionable bya plurality of actuators 124-127, each actuator being connected with thetip platform 108 by a corresponding pull-rod 120-123. As shown, each tipplatform 108 includes four actuators 124-127, an actuator beingpositioned on each side of the platform 108, allowing the platform 108to be moved in any direction in a two-dimensional space within thephysical limits of the actuators 124-127. The tips 142 extending fromthe cantilevers 112 and the actuators 124-127 can be electricallycoupled to a memory controller, or other outside source by a pluralityof interconnects 104, each interconnect 104 electrically connecting arespective cantilever 112 or actuator 124-127 to an interconnect node102. The interconnect 104 can be made from any number of conductivematerials.

Interconnect nodes 102 provide access to the die 100 from sourcesoutside of the die 100. For example, sense and control signals can besent to, and read from, the actuators 124-127 to determine a position ofthe actuators 124-127 relative to a neutral state. Different signals canbe sent to a tip 142 to read and/or write data to a media positioned inclose proximity to the tip 142. Many other signals can be sent throughthe interconnect node 102 and interconnect 104 as desired in the designof the die 100, the design of the system incorporating the die 100,and/or as desired to meet other design goals. Control signals can bepassed through appropriate interconnect nodes 102 and interconnects 104to direct the actuators 124-127 to perform some action. For instance, astimulus can be sent to an actuator 124-127 to actuate, causing thepull-rod 120-123 to be drawn toward the outside of the cell 118, therebymoving the platform 108. A control signal can be directed to multipleactuators 124-127 from multiple cells 118 directing multiple platforms108 to move in the same temporal space. In this way a plurality of cells118 can be controlled simultaneously, individually, or they can bemultiplexed. If cells 118 are multiplexed, then additional multiplexingcircuitry is required.

A die 100 can further comprise one or more test structures 114,116positioned outside of the cells 118. Test structures 114,116 can bemeasured to ensure proper fabrication of arms of the actuators 124-127and/or interconnects 104, or other features of the die 100. For example,a test signal can be applied to a test circuit 114 comprising anactuator arm and one or more test nodes, and measurements can be takenof the expansion rates of the arms without potentially damaging any ofthe interconnect nodes 102. Likewise, a test signal can be applied to atest actuator 116 and a measurement taken to determine the maximum forcethat the test actuator 116 can apply to a pull-rod 120-123. Other datacan be collected as well, such as in situ process testing of themanufacturing process, quality assurance, or reliability testing (e.g.,determining the stress limits of the test actuator 116 or the currentrequirements for inducing actuator movement). Any number of metrics canbe measured using appropriate test structures.

While the exemplary die 100 described above includes an array of four byfour (4×4) cells 118, a die 100 for use with systems and methods of thepresent invention can have any number of different arrangements of cells118 within the die 100 having the same, fewer, or more cells 118. Forexample, the die 100 can comprise a single row of sixteen cells 118, oralternatively, an eight by sixteen (8×16) rectangular arrangement ofcells 118. A die 100 can include as few as a single cell 118 or as manycells 118 as the manufacturing process permits on a single wafer. Assemiconductor manufacturing processes change so that greater diedensities and larger wafers can be made, a greater number of cells 118can be included on a single die 100. The number and arrangement of cells118 incorporated into a die 100 can be determined based on a targetapplication. For example, where medium storage capacity is required in avery small volume of space, fewer cells 118 can be used. One of ordinaryskill in the art can appreciate the myriad different design factors thatcan be considered in determining a die 100 configuration.

The exemplary die 100 of FIG. 1A can be associated with a media die(shown in FIG. 3A) comprising one or more media cells 318 (shown in FIG.3B), each media cell 318 corresponding to one or more tips 142. Theexemplary die 100 and media die can be positioned in operativeassociation to one another such that the tips 112 can be electricallyconnected with the media surface.

FIG. 1B is an illustration of a cell 118 from the exemplary die 100 ofFIG. 1A. The cell 118 includes sixteen tips 142 associated with aplatform 108 for writing and reading to a media. Each tip 142 extends,or is otherwise connected with a distal end of a cantilever 112. Thecantilever 112 can be connected with the platform 108. In otherembodiments, the platform 108 can be associated with fewer, or more tips142. The platform 108 can comprise a frame or lattice structure forsupporting the cantilevers 112, and can comprise some material orcombination of materials having a thermal coefficient across aprescribed operating range substantially similar to a thermalcoefficient of a corresponding media platform 308 (shown in FIG. 3B)across the same operating range. It can be important for reading andwriting that the thermal expansion of the platform 108 substantiallymatch a thermal expansion of the media platform 308 so that individualtips 142 arranged across the platform 108 can be properly positionedover a desired indicia or target location of a respective media device350 (also referred to herein as a media region). A disparity in athermal expansion coefficient between the media platform 308 and theplatform 108 that exceeds, for example, the platform's ability tocompensate for slight drift over an operating range, can result in a tip142 being improperly positioned over the media device 350, leading toread and/or write errors. For example, an indicia written to a mediadevice 350 can be improperly indexed by a servo system of the die 100,or the wrong indicia can be erroneously read, corrupting a result. Thetip 142 should be capable of reading an indicia that the tip 142 intendsto read, and write to a position to which the tip 142 intends to write(and to which the die 100 is capable of correctly indexing). The abilityof the platform 308 to compensate for slight drift over an operatingrange can determine how closely matched should be the coefficient ofthermal expansion of a platform 108 and the coefficient of thermalexpansion of a media platform 308, and can be dependent on the densityof information storage, a size of a written indicia, a size and/orgeometry of the platform 108, a size of the tip 142, and other factors.

The media platform 308 and tip platform 108 need not be made of the samematerial to achieve the desired thermal expansion rates, or desiredmatching of thermal expansion rates. It is known that materials can becarefully doped so that such materials are tailored to thermally expandat a desired rate over a desired temperature range. For example, in oneembodiment, a platform 108 for supporting a plurality of tips 142 cancomprise silicon, while a corresponding media platform 308 can comprisean alloyed metal having an equivalent coefficient of thermal expansionas silicon over the desired operating range (e.g., 0-70° C.). Further,in some embodiments, the platform 108 can comprise a plurality ofmaterials associated with one another so that a desired thermal drift isachieved as a result of the association of the plurality of materials.For example, referring to FIG. 1C, in an embodiment, one or more ofcantilevers 112 associated with a platform 108 can be mounted on asub-platform 192 (in this case a “C” -shaped sub-platform) connectedwith a main platform 190 the sub-platform comprising a material having ahigh thermal expansion coefficient (e.g., nickel or aluminum). The mainplatform 190 in this example comprises an oxide material. Eachsub-platform 192 is sized so that the sub-platform 192 expands at adesired rate, causing the cantilever 112 mounted on the sub-platform 192to drift with the thermal expansion of the sub-platform 192, therebytracking the thermal expansion of a corresponding media platform 308,despite the low expansion of the main platform 190. In such anembodiment, the main platform 190 can comprise a material having acoefficient of thermal expansion substantially lower than that of amaterial of the media platform 308, and the sub-platform 192 cancomprise a material having a coefficient of thermal expansion higherthan that of the material of the media platform 308, so that the driftof the cantilever 112, and by extension the tip 142, expands as desiredover the operating temperature of the die 100. The sub-platforms 192compensate for the difference in thermal expansion of the main platform190 and the media platform 308, and the geometry as well as the materialof the sub-platform 192 can be chosen to achieve the desired result. Thesub-platform 192 need not be “C” -shaped as shown. In still otherembodiments, a platform 108 in accordance with the present invention canbe arrayed with a composite of metal and oxide structures in a grid, thegeometries of the metal and oxide structures defining a net coefficientof thermal expansion of the composite platform 108 that is substantiallysimilar to a coefficient of thermal expansion of the media platform 308.One of ordinary skill in the art will appreciate the myriad differentcombinations of materials and geometries that can be employed to achievea platform 108 wherein the tips 142 drift with a change in temperatureat substantially the same rate as the expansion of the media platform308.

In an embodiment as shown in FIG. 1B, the platform 108 can comprise amaterial having a low coefficient of thermal expansion, for examplesilicon dioxide. Having a platform 108 with a frame structure of amaterial having a low coefficient of expansion can limit the amount ofdrift of a tip 142 within a corresponding media, and the amount of driftof the tip 142 relative to every other tip 142. The tips 142 cancomprise silicon, or some other conductive material, or alternatively aninsulator having a conductive coating. The tips 142 can be integrallyformed with the platform 108 using a combination of well knownsemiconductor manufacturing processes. One of ordinary skill in the artcan appreciate the means for forming cantilevers having conductive tips112 on an insulated frame.

Referring to FIGS. 1D and 1E, thermal drift between tips 142 can furtherbe limited by separating the die 100 into multiple cells 118. A cell 118can include a platform 108 of a limited size (i.e., a platform having asmall form factor). As shown in FIGS. 1A and 1B, each platform 108supports sixteen cantilevers 112, although in other embodiments fewer ormore cantilevers 112 can be supported, depending on a size of a platform108. The size of the platform 108 can be limited to a size that resultsin an acceptable level of drift during operation between tips 142positioned at a maximum distance from one another on the platform 108.For example, as shown schematically in FIG. 1D four cells 118 arearranged in a 2×2 square, each cell 118 having a platform 108 with aplatform center 109. The die 100 can heat because of a flow of currentthrough the die 100, movement of the platforms 108 within the cells 118,and environmental effects. As the die 100 heats, the platforms 108 canexpand. As can be seen in FIG. 1D, a first tip t1 and a second tip t2are associated with a first platform 108 a, and a third tip t3 isassociated with a second platform 108 b. The first tip at an initialposition t1 can shift to a final position t1′ due to thermal expansionof the first platform 108 a. A second tip at an initial position t2 (adistance x from the center 109 a of the first platform 108 a) can shiftto a final position t2′ due to thermal expansion. An initial distance d1between the first tip and the second tip thus expands to a finaldistance d2 between the first tip and the second tip. Thermal drift canresult in possible servo errors and misreading of data. The thermalexpansion of a platform 108 is isolated relative to every other platform108 and the platform 108 expands into empty space within the cell 118.Such expansion can possibly cause slight displacement of the actuators124-127 and interconnects 104, but does not cause the overall cell 118size to increase, limiting the effects of thermal expansion on tipdrift. While the platform 108 expands, the center 109 of the platform108 can remain in the same position, roughly. Thus for example, thethird tip, also a distance x from the center 109 b of the secondplatform 108 b, shifts to a final position t3′ due to thermal expansion.An initial distance d3 between the first tip and the third tip expandsto a final distance d4 between the first tip and the third tip. Theincrease in absolute distance between the first tip and the third tip(d4-d3) is roughly the same as the increase in absolute distance betweenthe first tip and the second tip (d2-d1). Thus, d4-d3=d2-d1.

As shown in the schematic of FIG. 1E, a single cell 218 having a sizesimilar to the space occupied by the four cells 118 of FIG. 1D includesa platform 208 that expands at a compounded rate relative to theexpansion of each of the platforms 108 of FIG. 1D. As can be seen, afirst tip at an initial position t1 can shift to a final position t1″due to thermal expansion of the platform 208. The first tip, thoughlocated in the same initial position as the first tip of FIG. 1D, is afurther distance from the center 209 of the corresponding platform 208than the first tip of FIG. 1D. As a result, the distance between thefinal position t1″ and the initial position t1 of the first tip of thesingle platform 208 is greater than the distance between the finalposition t1′ and the initial position t1 of the first tip for each ofthe smaller platforms 108. A third tip at an initial position t3 canshift to a final position t3″ due to thermal expansion, again with thedistance between the final position t3″ and the initial position t3 ofthe third tip of the single platform 208 being greater than the distancebetween the final position t3′ and the initial position t3 of the thirdtip for each of the smaller platforms 108. As a result, a distance D3between the first tip and the third tip of the single platform 208expands to a distance D4 between the first tip and the third tip of thesingle platform 208. The expansion in distance (D4-D3) across a singlelarge platform 208 is greater than the expansion in distance (d4-d3)across two smaller platforms 108 (D4-D3>d4-d3). The expansion of theplatform 208 is compounded because the platform 208 must expand outwardinto the single cell 218. Of course, the platform 208 of FIG. 1E willhave relatively smaller expansion across platforms 208 arranged in a 2×2square (as the smaller platforms 108 of FIG. 1D are arranged), whencompared with a platform (not shown) yet four times the size of theplatform 208 of FIG. 1E. Systems and methods in accordance with thepresent invention can scale the size of a tip platform 108 so that thetip platform 108 has appropriate expansion characteristics that arewithin the general error tolerance of the circuitry (e.g., positioningcircuitry, servo circuitry, etc.) of the die 100. It has beendemonstrated that a die 100 as described above with reference to FIG. 1Aincludes such a tip platform 108.

Use of small form factor platforms 108 as described above can provide amemory device and system with thermal stability. Further, generallyplatforms having a relatively small number of cantilevers, wherein asmall number of cantilevers is roughly defined as approximately onehundred cantilevers or less (i.e., an order of magnitude smaller than aplatform supporting one thousand tips), can provide a memory device andsystem with thermal stability. Thermal stability can be defined ashaving thermal drift characteristics over a desired operating range thatare within a tolerance of the system circuitry. One of ordinary skill inthe art will note from the descriptions and benefits described hereinthat platforms sized to support fewer cantilevers can potentially enjoysuch benefits to an increasing degree. In additional to thermalstability a small form factor platform 108 has a lower mass whencompared with a larger form factor platform 108. In general, a platform108 having lower mass can be actuated at a higher speed when comparedwith a platform 108 comprising a similar material having a higher mass.Small form factor platforms 108, therefore, can provide a capability offaster access speed, improving overall performance of a memory device.Further, small form factor platforms 108 provide inherent faulttolerance. In the event that a fault tolerance scheme for a set ofactuator arms (as described below) fails for a single platform 108, aloss of capacity of a memory device is limited to the portion of a mediadevice accessed by the single platform 108. A tip platform 108 thatsupports a relatively small number of cantilevers 112 (e.g., sixteencantilevers) can have advantages over a tip platform that supportshundreds or thousands of cantilevers, for example. However, systems andmethods in accordance with the present invention can include one or moreplatforms supporting hundreds or thousands of cantilevers, wheredesired.

Referring again to FIG. 1B, a platform 108 is positionable using fourbi-morph actuators: an X-left actuator 124 coupled by a left pull-rod120 with the tip platform 108, a Y-top actuator 125 coupled by a toppull-rod 121 with the tip platform 108, an X-right actuator 126 coupledby a right pull-rod 122 with the tip platform 108, and a Y-bottomactuator 127 coupled by a bottom pull-rod 123 with the tip platform 108.Each actuator 124-127 includes two sets of arms connected by a couplingbar 141, with each set of arms including a plurality of bi-morph arms140. When a voltage is applied via an interconnect 104 to a bi-morph arm140, the bi-morph arm 140 bends toward the outer edge of the cell 118.Collectively, the two sets of arms draw the pull-rod 120-123, which inturn pulls the platform 108, causing the platform 108 to shift inposition toward the energized actuator. The platform 108 can haverelative movement typically in the range of plus or minus fifty microns,but this range can be extended or reduced as required by various designgoals. Also, the actuators 124-127 are not required to have an identicalmovement range in order to permit the cell 118 to function. For example,the X-axis actuators 124,126 could have a range of plus to minus fiftymicrons while the Y-axis actuators 125,127 could have a range of plus tominus sixty-five microns, or vice versa. In other embodiments, theactuators 124-127 can comprise structures other than bi-morphstructures, for example, the actuators 124-127 can comprisecomb-electrode structures (for example as described in U.S. patentapplication Ser. No. 09/465,592, entitled “Molecular Memory Medium andMolecular Memory Integrated Circuit,” Attorney Docket No. LAZE-01000US0,filed Dec. 17, 1999). In still other embodiments, the tip platform 108need not include actuators, for example where a corresponding mediaplatform 308 is employed having sufficient range of movement.

A plurality of interconnects 104 are electrically coupled with theplatform 108, for example in bundles 103, with each bundle 103 includinginterconnects 104 associated with a plurality of tips 142. As shown, thecell 118 includes four bundles 103, with each bundle 103 including fourinterconnects 104 corresponding to four tips 142. In other embodiments,the cell 118 can include one or more bundles 103, and each bundle 103can comprise one or more interconnects 104. Each bundle 103 can becoiled or routed in an accordion-like fashion so that the interconnect104 can expand—for example by partially unfolding, thereby preventingthe interconnect 104 from restricting movement of the tip platform 108away from the interconnect 104—or collapse, for example by bending toaccommodate a shorter distance where the tip platform 108 is drawntoward the interconnect 104. A separate set of interconnects (not shown)is connected with each actuator 124-127 to energize the actuator124-127. In some embodiments, the interconnect 104 can restrictundesired movement of the tip platform 108. For example, in anembodiment an interconnect 104 can include a cross-section having a deepz dimension, i.e. having a dimension along a plane perpendicular to theplane of the die 100 (also referred to herein as a z dimension). Suchgeometry can restrict movement of the platform 108 in the z dimension,thereby helping to ensure a desired z positioning of the platform 108relative to the media platform 308. Where the interconnect 104 isconfigured, as described, to restrict z movement of the platform 108, itcan be said that the interconnect 104 acts as a “suspension.” Such anarrangement can have an advantage that actuators 124-127 need not holdthe platform 108 as rigid in the z dimension.

The actuators 124-127 can further include a fault tolerant design sothat the actuators 124-127 will function so long as they are notcompletely destroyed, thereby increasing reliability and lifetime of adie. The fault tolerant design is described in more detail in U.S.patent application Ser. No. 10/684,760, entitled “Fault TolerantMicro-Electro Mechanical Actuators,” filed Oct. 14, 2003. As can be seenin FIG. 1B, each actuator 124-127 includes two sets of arms, each sethaving multiple bi-morph arms 140. If one of the arms on an actuator124-127 breaks, that arm 140 will form an open circuit. A broken arm 140will reduce the potential force that an actuator 124-127 can exert uponthe platform 108, thereby reducing the maximum range with which theactuator 124-127 can move the platform 108. The actuator 124-127 can bebuilt so that the maximum range of movement of the actuator 124-127exceeds the usable range of movement of the tip 142 so that whereactuator 124-127 performance degrades, no degradation in cell 118performance results. FIG. 1B shows each actuator 124-127 with a total oftwenty arms 140. Increasing the number of arms 140 can increase thefault tolerance of the actuator 124-127, but it will also increase theamount of physical space required for the actuator 124-127. Likewise,fewer arms 140, such as six arms 140, can reduce the amount of physicalspace required for the actuator 124-1276, but it will in turn increasethe sensitivity that an actuator 124-127 has to damage, thus reducingits efficiency for being fault tolerant.

A tip 142 and a corresponding cantilever 112 can be formed so that thetip is in constant contact or near contact as the tip platform 108 movesalong the media surface. In one embodiment in accordance of the presentinvention, the cantilever 112 can have curvature such that thecantilever 112 curves away from a plane defined by the platform 108, andtoward the media surface. Consequently, as a media platform 308 (shownin FIG. 3A) is positioned in close proximity to the tip platform 108,the tip 142 will make first contact with the media platform 308. Thecantilever 112 can be designed such that it has a spring-like responsewhen pressure is applied to the cantilever 112 from either the tipplatform 108 or media platform 308. Hence, small changes in the distancebetween the tip platform 108 and the media platform 308 will notnecessarily cause the cantilever 112 to break electrical contact withthe media surface. The tip 142 of the cantilever 112 can be positionedwithin the media through movement of the tip platform 108 and/or themedia platform 308 by the respective actuators 124-127.

In other embodiments, the tips 142 can have independent directionalcontrol. Thus, cantilevers 112 could be designed to be capable of movingalong all three axes as defined by reference 199 (x-axis, y-axis, andz-axis). Such a design would require additional interconnections 104 inorder to allow control signals to direct cantilevers 112.

Forming Ultra-Sharp Tips

To form fine domains in a media surface, a tip having an extremely finetip width can be formed. One method of forming a tip in accordance withthe present invention can include forming a silicon nitride (SiN) hardmask on a silicon substrate and applying an isotropic etch to form asharp tip. The method can include depositing SiN on a silicon wafer, forexample using plasma enhanced chemical vapor deposition (PECVD)processing techniques or low pressure chemical vapor deposition (LPCVD)processing techniques. The wafer is then coated with photoresist, andexposed using standard lithography techniques to form a tip patterncomprising one or more small squares (also referred to herein as pads)sized according to a desired tip height. For example, where anapproximately 2μm tall tip is desired, a 3μm×3μm square can be formed.The SiN not protected by the photoresist mask can be removed from thesurface using an anisotropic etch, for example in a plasma etcher. Thephotoresist can optionally be removed, leaving one or more SiN hardmasks.

FIG. 2 illustrates processing of a portion of a wafer 280 over a seriesof recipe steps. A hard mask 284 is formed over a silicon surface 282 asdescribed above. The wafer can then be isotropically etched, for examplein a liquid chemical bath (i.e., wet etched) or in a plasma etcher usinga sulfur hexaflouride (SF₆) chemistry. The isotropic etch can be appliedsuch that the hard mask is undercut by about 1μm , as shown by thesecond line 286 in FIG. 2. The etch can be endpointed visually, forexample by observing the structures under an optical microscope. If thephotoresist has not been removed prior to performing the isotropic etch,the photoresist must then be removed. The wafers are cleaned to removeresidual photoresist and other contamination prior to subsequentprocessing, for example in a wet chemical bath such as a piranha.Following these steps, the wafer is placed in an oxide growth furnaceand oxidized so that a portion of the silicon is consumed during theoxide growth process, the portion corresponding to the third line 288.Approximately 1μm of oxide can be grown to form a satisfactory tip. Thenitride hard mask impedes oxide growth at the top of the tip, and theoxide grows steadily inward from the sides at least until the oxidecompletely undercuts the nitride pad. Once the wafer is removed from thefurnace, the oxide can be stripped, for example in a chemical bath byhydrofluoric (HF) acid. The nitride pads fall off as the oxide isundercut by the etchant. The high etch selectivity between the oxide andthe silicon will result in removal of the oxide with approximately noremoval of silicon. The result of this step is the formation of ultrasharp silicon tips 242. The wafers can further be reoxidized, ifdesired, to form oxide tips. Further, the tip height can be increased byperforming an anisotropic silicon etch either before the isotropic etchor after.

Storage Media for Use With the Read/Write Engine

FIGS. 3A and 3B illustrate an exemplary media die 300 and an exemplarymedia cell 318 from the exemplary media die 300 for use with systems andmethods in accordance with the present invention. The media die 300comprises sixteen cells 318, each cell 318 including a media platform308 on which sixteen media devices 350 are connected. The platform 308is made positionable by a plurality of actuators 324-327, each actuatorbeing connected with the media platform 308 by a corresponding pull-rod320-323. As shown, each media platform 308 includes four actuators324-327, an actuator being positioned on each side of the media platform308, allowing the platform 308 to be moved in any direction in atwo-dimensional space within the physical limits of the actuators324-327. The media device 350 and the actuators 324-327 can beelectrically coupled to a memory controller, or other outside source bya plurality of interconnects 304, each interconnect 304 electricallyconnecting a respective memory device 350 or actuator 324-327 to aninterconnect node 302. The interconnect 304 can be made from any numberof conductive materials.

As with the die 100, the media die 300 includes interconnect nodes 302that provide access to the media die 300 from sources outside of themedia die 300. Further, the media die 300 can likewise further compriseone or more test structures 314,316 positioned outside of the cells 318.While the media die 100 shown in FIG. 3A includes an array of four byfour (4×4) cells 318, a media die 100 for use with systems and methodsof the present invention can have any number of different arrangementsof media cells 318 within the media die 300 configured and arranged tocorrespond to a configuration of a corresponding die 100. As describedabove, the exemplary die 100 and media die 300 can be positioned inoperative association relation to one another such that the tips 142 canbe electrically connected with corresponding media devices 350,

FIG. 3B is an illustration of a memory cell 318 for use with embodimentsof the present invention. The memory cell 318 includes a platform 308connected with sixteen media device 350 which can be active or passive(as described in detail below). As with the tip platform 208, the mediaplatform 308 can comprise a frame or lattice structure for supportingthe media devices 350, and comprise a material having a coefficient ofthermal expansion substantial similar to the material comprising theplatform 108. As above, in some embodiment the media platform 308 cancomprise a composite structure. In one embodiment, the media platform308 can comprise some material having a low coefficient of expansion,for example a silicon dioxide. Having a platform 308 with a framestructure of a material having a low coefficient of expansion can minifythe amount of drift of each media device 350 relative to a correspondingtip 142. Each media device 350 can be isolated from every other mediadevice 350, or the media cell 318 can be a continuous surface. In otherembodiments, the platform 308 can be connected with fewer or more mediadevices 350. A media die 300 can include one or more memory cells 318,for example corresponding to a number of tip platforms 108 on a die 100.

As with the tip platform 208, the media platform 308 is positionableusing four bi-morph actuators: an X-left actuator 322 coupled by a leftpull-rod 320 with a media platform 308, a Y-top actuator 326 coupled bya top pull-rod 324 with the media platform 308, an X-right actuator 328coupled by a right pull-rod 330 with the media platform 308, and aY-bottom actuator 332 coupled by a bottom pull-rod 334 with the mediaplatform 308. Each actuator 324-327 includes two sets of arms connectedby a coupling bar 341, each set including a plurality of bi-morph arms340. When a voltage is applied via an interconnect (not shown) to thebi-morph arms 340, the bi-morph arms 340 bends such that the attachedpull-rod is pulled into the actuator. Collectively, the two sets of armscan draw the pull-rod 320-323, which in turn pulls the media platform308, causing the media platform 308 to shift in position toward theenergized actuator. As with the tip platform 208, the media platform 308can have relative movement typically in the range of plus or minus fiftymicrons, but this range can be extended or reduced as required byvarious design goals. Also, the actuators 324-327 are not required tohave an identical movement range in order to permit the cell 318 tofunction. In other embodiments, the actuators 324-327 can comprisestructures other than bi-morph structures, for example, the actuators324-327 can comprise comb-electrode structures. In still otherembodiments, the media platform 308 need not include actuators, forexample where a corresponding tip platform 208 is employed havingsufficient range of movement. As described above, the actuators 324-327can further include a fault tolerant design so that the actuators324-327 will function so long as they are not completely destroyed,thereby increasing reliability and lifetime of a die.

A plurality of interconnects 304 are electrically coupled with the mediaplatform 308, for example in bundles with each bundle includinginterconnects 304 corresponding to a plurality of media devices 350. Asshown, the cell 318 includes four bundles, with each bundle includingfour interconnects 304 corresponding to four media devices 350. In otherembodiments, the cell 318 can include one or more bundles 303, and eachbundle 303 can comprise one or more interconnects 304. Each bundle 303can be coiled or routed in an accordion-like fashion so that theinterconnect 304 can expand—for example by partially unfolding, therebypreventing the interconnect 304 from restricting movement of the mediaplatform 308 away from the interconnect 304—or collapse, for example bybending to accommodate a shorter distance where the media platform 308is drawn toward the interconnect 304. Additionally, a pair ofinterconnects 304 are connected with each actuator to energize theactuator 304, as described above. In some embodiments, the interconnect304 can restrict undesired movement of the media platform 308. Forexample, as above, in an embodiment an interconnect 304 can include across-section having a deep z dimension, i.e. having a dimension along aplane perpendicular to the plane of the die 300 (also referred to hereinas a z dimension). Such geometry can restrict movement of the mediaplatform 308 in the z dimension, thereby helping to ensure a desired zpositioning of the media platform 308 relative to the platform 308.Where the interconnect 304 is configured, as described, to restrict zmovement of the tip platform 108, it can be said that the interconnect304 acts as a “suspension.” Such an arrangement can have an advantagethat actuators 324-327 need not hold the media platform 308 as rigid inthe z dimension.

The actuators 324-327 can further include a fault tolerant design sothat the actuators 324-327 will function as long as they are notcompletely destroyed, thereby increasing reliability and lifetime of adie. As can be seen in FIG. 3, each actuator 324-327 includes two setsof arms, each set having multiple arms 340. If one of the arms 340breaks, that arm 340 will form an open circuit. A broken arm 340 willreduce the potential force that an actuator 324-327 can exert upon themedia platform 308, thereby reducing the maximum range with which theactuator 324-327 can move the media platform 308. The actuator 324-327can be built so that the maximum range of movement of the actuator324-327 exceeds the usable range of movement of the corresponding tips242 so that where actuator 324-327 performance degrades, no degradationin media cell 318 performance results. FIG. 3 shows each actuator324-327 with a total of twenty arms 340. Increasing the number of arms340 can increase the fault tolerance of the actuator 324-327, but itwill also increase the amount of physical space required for theactuator 324-327. Likewise, fewer arms 340, such as six arms 340, canreduce the amount of physical space required for the actuator 324-327,but it will in turn increase the sensitivity that an actuator 324-327has to damage, thus reducing its efficiency for being fault tolerant.

FIG. 4A is a cross-section of an embodiment of a media device 450 in anunwritten state for use with systems and methods in accordance thepresent invention. The media device 450 includes a substrate 452, forexample comprising silicon, an under-layer 454 formed over the siliconsubstrate, a phase change layer 456 formed over the under-layer 454, andoptionally an over-layer 458 formed over the phase change layer 456. Theunder-layer 454 can comprise a highly conductive material, therebydrawing heat away from the phase change layer 456, facilitating fastcooling of the phase change layer 456. In an embodiment, the under-layer454 can comprise tungsten, while in other embodiments the under-layer454 can comprise one or more of platinum, gold, aluminum, and copper. Instill other embodiments, the under-layer 454 can comprise some othermaterial having high conductivity. One of ordinary skill in the art canappreciate the myriad different materials for forming the under-layer454. Where it is desired that the under-layer 454 be insulated from thesubstrate 452, there may be an inbetween layer of insulator between theunder-layer 454 and the substrate 452. For example, in an embodiment theinbetween layer can comprise one of an oxide and a nitride material,thereby insulating the media 456 from the substrate 452.

Where an over-layer 458 is included in the media device 450, theover-layer 458 can comprise a material different from that of the phasechange layer 456, and may be selected to prevent physical damage to thephase change layer 456 and/or the tip 442 when the tip 442 contacts theover-layer 458. The over-layer 458 can comprise a material that isresistant to wear, thereby extending the lifetime of the over-layer 458and/or the tip 442. The over-layer 458 typically includes a lowconductance characteristic, and a high hardness characteristic. Forexample, in an embodiment the over-layer 458 can comprise titaniumnitride (TiN), a hard material that conducts poorly. However, it shouldbe noted that it can be advantageous (as described in detail below) toemploy an anisotropic columnar material that conducts current morereadily through a film than across a film. TiN is one such anisotropiccolumnar material. In another embodiment, the over-layer 458 cancomprise diamond-like carbon (DLC). The conductivity of diamond-likecarbon can be adjusted in the manufacturing process through a variety oftechniques. One such technique includes using a dopant such as nitrogenin the formation of the diamond-like carbon. In still anotherembodiment, the over-layer include molybdenum nitride (MoN), anothersuch substantially anisotropic columnar material. Many different metalnitrides can be used.

In yet another embodiment of a media device 450, the over-layer 458 cancomprise an insulator. For example, the over-layer 458 can comprisesilicon nitride (SiN) or oxide. Where an insulator is used as anover-layer 458, current applied to the media device 450 from the tipmust tunnel through the over-layer 458 before reaching the phase changelayer 456. Thus, in one embodiment, the insulator used for over-layer458 is thin (relative to the phase change layer 456), thereby reducingthe amount of tunneling required before a current can interact withphase change layer 456. In another embodiment, the insulator forover-layer 458 is an oxide.

In yet a further embodiment the over-layer can comprise a cermet-likematerial. Cermets are combinations of ceramic insulators (commonlydielectrics) and metal conductors that form a matrix. The matrix canhave a concrete-like structure, where the metal is analogous to rocks inconcrete and the dielectric is analogous to the “glue” that holds therocks together. It can also have a columnar structure much like TiN.Either form will allow a relative anisotropic conductivity such that thecurrent will preferably flow through the film rather than flow laterallyacross the film. In still other embodiments, the phase change materialcan be replaced with a cermet that comprises a phase change material asa conductor, surrounded by a matrix of an insulator. In still otherembodiments, the phase change layer can consist of isolated dots,surrounded by an insulator. In alternative of such embodiments, thephase change layer can have discrete conductors over the dots, notelectrically connected with adjacent dots. In still other embodiments,the over-layer can consist of a material that exhibits non-linearconductive properties with voltage, particularly those that haveincreasing conductivity with higher voltage potential. Such materialsinclude tin oxide (SnO). In still another embodiment, the over-layer cancomprise a material that exhibits non-linear conductive properties withtemperature, particularly those that have increasing conductivity withhigher temperature. Such materials include many semiconductors such assilicon. Many of these alternative materials can be used together suchthat the combination increases the anisotropic conductivitycharacteristic of the over-layer. Further, these over-layer materialscan be used sequentially, rather than mixed together, to enhance theperformance characteristics of the over-layer. For example, a very thinlayer of carbon can be added over TiN to form a barrier to oxidization,as well as to improve lubricity of the surface.

In some embodiments of a media device 450, the phase change layer 456comprises a phase change material. The phase change material caninclude, for example, germanium (Ge), antimony (Sb) and/or tellurium(Te) (such phase change materials are commonly referred to aschalcogenides). As a portion of the phase change material is heatedbeyond some threshold temperature and then cooled very quickly (i.e.,quenched) the phase of the material changes from a crystalline state toan amorphous state. Conversely, if the phase change material is heatedabove some threshold and then allowed to cool slowly, the material willtend to re-crystallize. As a result of these phase changes, theresistivity of the material changes. This resistivity change is quitelarge in phase change materials and can be easily detected by a tip thatis conductive or that includes a conductive coating by passing currentthrough the tip 442 and the media device 450. Phase change materials arewell known in the art and can be found disclosed in numerous references,for example U.S. Pat. Nos. 3,271,591 and 3,530,441 both issued toOvshinsky and incorporated herein by reference. In other embodiments ofthe media device 450 the phase change layer 456 can be substituted by amagneto-optic material.

In addition to an over-layer 458, a media device 450 can optionallyinclude a lubricant 451 that is formed, deposited, adhered, or otherwiseplaced, positioned or applied over the over-layer 458. In someembodiments, the lubricant 451 can be a liquid. In other embodiments,the lubricant 451 can be a non-liquid, such as molybdenum disulfide. Inanother embodiment, the lubricant 451 can be a form of carbon. Thelubricant 451 can be applied to an over-layer 458 using myriad differenttechniques. In an embodiment, the lubricant 451 can be deposited on theover-layer 458 using a deposition process. In another embodiment, thelubricant 451 can be sprayed onto the over-layer 458. One of ordinaryskill in the art will appreciate the myriad different lubricants thatcan be employed to provide a desired relationship between a tip and amedia device 450, and the myriad different techniques for applying suchlubricant 451.

The media device 450 can be formed using traditional semiconductormanufacturing processes for depositing or growing layers of film insequence using deposition chambers (e.g., chemical vapor deposition(CVD) chambers, plasma vapor deposition (PVD) chambers) and/or furnaces,for instance. Alternatively, the media device 450 can be formed using ashadow mask. Where a shadow mask is used, a mask wafer that contains atleast one aperture is placed over a final wafer to form a media device450. The mask wafer and final wafer are then subjected to a depositionprocess. During the deposition process, chemicals pass through theshadow mask and are deposited to form a media device 450. Additionally,the media and/or media stack can be deposited over a lift-off resistlayer. The resist layer and excess media stack can be removed by placinga waver on which the media device 450 is formed in a solvent bath thatdissolves the resist and allows excess material to be removed. One ofordinary skill in the art can appreciate the myriad different techniquesfor forming a media device 450.

FIG. 4B is a cross-section of the media device 450 of FIG. 4A in whichan indicia 460 (which can represent a data bit, and which forconvenience is referred to herein as a data bit) has been formed. In anembodiment a data bit 460 can be formed by passing current through thephase change layer 456 from a tip 442 positioned in contact or nearcontact with the over-layer 458, thereby heating the phase change layer456 near the tip 442. As described above, when the temperature of thephase change layer 456 exceeds a threshold temperature the phase changelayer 456 becomes semi-molten or molten, and can be quenched to form anamorphous bit. In other embodiments, the bulk phase change layer 456 canhave an amorphous structure and when heated can be more slowly cooled toform a crystalline structure. Quenching is defined as a rate of coolingthat achieves an amorphous structure, or a partially non-crystallinestructure, from a molten or semi-molten phase change material. Cooling,slow cooling, or simple cooling is defined as a rate of cooling that isslow enough that the phase change material forms a crystalline structurefrom a molten or semi-molten material. In an embodiment, quenching canbe achieved by removing current from the heated portion, and allowing aconductive under-layer to remove heat from the heated portion, whilesimple cooling can be achieved by ramping down current from the heatedportion and allowing the conductive under-layer to remove heat from theheated portion. In other embodiments, quenching can be achieved by notonly removing current, but by diverting current from the heated portionvia a clamp (described below), while simple cooling can include removingcurrent from the heated portion. An exact technique for achievingquenching can depend on the phase change material, the conductivity ofthe under-layer, and the temperature to which the portion is heated, aswell as environmental and other factors. Further, where multipleresistivity states are used (i.e., data is stored in a non-binaryfashion), cooling and quenching can have varying cooling rates and canbe combined with heating temperature to achieve multiple differentresistivity states as desired and designed.

In a binary system, the data bit 460 has an incongruous resistancerelative to the surrounding bulk phase change layer 456, the incongruityrepresenting data stored in the media device 450. To erase the data bit460 from the media device 450, a second current is applied to a portionof the phase change layer 456 that includes the data bit 460 to heat theportion and properly cool the portion to form the structure of the bulkphase change layer 456 (whether amorphous or crystalline). Theresistivity of the data bit 460 is consequently changed to that of anunwritten state. For example, where the bulk phase change layer 456 hasan amorphous structure, a crystalline bit 460 can be erased by heating aportion of the phase change layer 456 containing the crystalline bit 460to a second, higher temperature than was applied to form the crystallinebit 460. The portion is then quenched to ambient temperature, therebycausing the portion to form an amorphous structure having a resistivitysimilar to the original resistivity of the bulk phase change layer 456.

For example, in an embodiment of the media device 450 in accordance withthe present invention the phase change layer 456 can comprise achalcogenide. The bulk of the phase change layer 456 can have acrystalline structure, and can correspond to an unwritten state. To setthe data bit 460 to a written state, a first current can be applied to atarget portion of the phase change layer 456 causing the portion of thephase change layer 456 to heat to a threshold temperature (which can bea melting temperature of a phase change material), which in oneembodiment of a chalcogenide can be approximately 600° C. The phasechange layer 456 can be quenched to ambient temperature, and the portionof the phase change layer 456 heated to the threshold temperature willhave a resistivity higher than the bulk, unwritten phase change layer456, thereby forming an indicia that can be interpreted as a data bit460. In such an embodiment, quenching can be achieved by removing thefirst current at a rate ranging from 10 to 100 nanoseconds although therate can vary substantially. To reset the data bit 460 to an unwrittenstate (also referred to herein as a reset state, and an erased state), asecond current can be applied so that the portion of the phase changelayer 456 is heated to a temperature approximately equal to atemperature ranging from 170° C. to 250° C. (or greater, including up tothe threshold temperature). (The temperature range can depend on thecomposition of the chalcogenide, and in some embodiments can have someother range, such as from 100° C. to 250° C., or greater.) As theportion of the phase change layer 456 cools to ambient temperature, adata bit 460 forms having a crystalline structure, the crystallinestructure having a resistivity that approximates the resistivity of thebulk, unwritten phase change layer 456. Different materials can be usedfor the phase change layer 456 to adjust the operating range for writingand erasing a data bit 460. Altering the proportions of the elements ina chalcogenide is one way of altering the written and erasedtemperatures.

It should be noted that although temperatures have been described withsome level of specificity, the state of the portion to which heat isapplied is generally most influenced by a rate of cooling of theportion. A rate of cooling can be influenced by a rate at which thecurrent through the heated portion is removed from the heated portion,and how quickly the heat can be carried away from the heated portion(i.e., the conductivity of the materials of the media device 450 stack).It is largely thought that where a minimum temperature is reached (i.e.,the crystallization temperature, which in the embodiment described aboveis approximately 170° C.) and maintained, the material can be cooledslowly enough that the material can re-crystallize. Such cooling can beachieved using a number of different techniques, including ramping downa current applied to the heated portion. In some embodiments, thecurrent can be ramped down in stages, and the heated portion can bemaintained at desired temperature levels for desired times, so thatcrystallization is achieved across substantially the entire portion. Oneof ordinary skill in the art can appreciate the different applicationsof phase change layer 456 and the techniques for achieving changes inmaterial properties of the phase change layer 456.

In other embodiments, the phase change layer 456 can comprise achalcogenide, the bulk of which includes an amorphous structurecorresponding to an unwritten state. In such embodiments, targetedportions of the phase change layer 456 can be heated and slowly cooledso that the portion crystallizes, forming an indicia that can beinterpreted as a data bit 460 having a written state. Systems andmethods in accordance with the present invention should not beinterpreted as being limited to the conventions disclosed herein or thetemperature range or material characteristics described. Systems andmethods in accordance with the present invention are meant to apply toall such applications of phase change layer 456 having indiciacorresponding to material property.

As described in the embodiment above, to erase an amorphous data bit460, a second current can be applied to the portion of the phase changelayer 456 including the data bit 460. As the portion cools, theresistivity of the portion returns to a value approximately equal to theoriginal value of the bulk phase change layer 456, thereby erasing thedata bit 460. Multiple data bits 460 can be reset to an unwritten stateby applying heat to a large region of the media device 450. Forinstance, the media device 450 can apply a current to a buried heaterunder the media device 450. This heating can be applied to all of thememory locations in the media device 450 or a portion of the mediadevice 450 such that the resistivity of heated portion of the phasechange layer 456 is returned to an unwritten value. For example, in anembodiment strip heaters can be positioned to heat up bands within themedia device 450. In still other embodiments, a laser can be applied toat least a portion of the media device 450 to heat the portion. Forexample, where the platform 108 comprises a transparent material, suchas silicon dioxide, a laser can be applied through the platform 108 toheat one or more media devices 450 on the media platform 308. In stillother embodiments, a matrix of diode heaters can be formed toselectively heat portions of a media device 450. Such bulk erasing canadd complexity to one or both dies 100,300 but can potentially providebenefits such as reduced tip wear.

In still another embodiment of a media device 450 in accordance with thepresent invention, the phase change layer 456 is capable of having aplurality of resistivity states. For example, in the unwritten state,the phase change layer 456 can have a first resistivity. The phasechange layer 456 can then be heated to different temperatures andquenched, thereby changing the resistivity of the phase change layer456. In an embodiment, a read voltage can be applied across a tip andphase change layer 456 to sense whether the resistivity of the phasechange layer 456 is at or near the initial, unwritten state for the bulkphase change layer 456 or at some state that is sufficiently differentto be measured as a state other than the unwritten state. The phasechange layer 456 can have a first resistivity characteristic at aninitial, or unwritten state. A first current can then be applied to thephase change layer 456, heating the phase change layer 456 to a firsttemperature. The first current can be removed from the phase changelayer 456 and the phase change layer 456 cools to form a structurehaving a second resistivity characteristic. In an embodiment, theresistivity of the phase change layer 456 in this second state can bemeasured. The second resistivity can vary depending on the temperaturethat the phase change layer 456 is heated to by the first current, andthe cooling time of the phase change layer 456. A range of resistivitymeasurements can correspond to a data value, with different rangescorresponding to different data values. A plurality of resistivityranges can be employed as a plurality of data values using a datastorage scheme other than binary, for example. In an embodiment, a datastorage scheme including three data values can utilize a base-3 systemrather than a binary system for storing data. In another data storagescheme, where four different resistivity states are possible for eachdata bit, each data bit can correspond to two bits (e.g., each cancorrespond to 00, 01, 10 or 11). Alternatively, the precise value of theresistivity characteristic for phase change layer 456 can be measuredfor more precise analog data storage. Measurements of the resistivityare preferentially obtained by taking measurements which are relative toa first state of the media, but can also be obtained by taking absolutevalue measurements. Another method of measurement extracts the data asthe derivative of the measured data.

The phase change layer 456 can possess a large dynamic range forresistivity states, thereby allowing analog data storage. The dynamicrange for the resistivity characteristic of the phase change layer 456can be approximately 3 to 4 orders of magnitude (i.e., 1000-10,000×).For example, the resistivity can range from lower than 0.1ohm-centimeters to 1000 ohm-centimeters or more. In one embodiment,however, heating from the probe on the phase change material can causeonly a very small area of media 456 to undergo a change in itsresistivity. In this form a smaller dynamic range may be observed, asonly a small region of the media is altered. Media systems typicallydisplay a range of values in the initially deposited state, such thatthe resistance values measured vary at different locations.Additionally, variations in the thickness of the phase change materialand the over-layer can form differences in the measured resistance assensed through a tip. These differences manifest as noise in a signalread from the tip. One method of reducing noise uses the analog natureof the recording medium. The state of the media under the tip can bedetected by means described elsewhere. A voltage waveform is thenapplied to the tip to heat and cool the media such that the mediachanges state. The media under the tip is then read again. If the valueis not within the desired noise tolerance for the location, anothervoltage waveform is applied to change the value to within the desiredtolerance range. The waveform can consist of a crystalline pulse or anamorphizing pulse, or some combination of such pulses. Multiple cyclesof reading and writing can be used to drive the value to the desiredtolerance range. In this way, the media can be adaptively written toreduce noise in the subsequent read back signal. Alternatively, thewaveforms used to drive the recording medium to a desired state canoperate during the heating and cooling process itself by measuring theresistance state while heating and cooling.

In other embodiments, the media 456 can be a material other than a phasechange material. For example, the media device 450 can include a chargestorage-type media. Charge storage media store data as trapped chargesin dielectrics. Thus, for charge storage media, the media 456 would be adielectric material that traps charges when in a written state. Changingthe media 456 back to an unwritten state simply requires the removal ofthe trapped charges. For instance, a positive current can be used tostore charges in the media 456. A negative current can then be used toremove the stored charges from the media 456.

Super Resolution Writing and Reading

A tip formed as described above can include a distal end having a radiusof curvature of about 25 nm, in one embodiment. As the tip moves acrossthe media surface, in contact or near contact with the surface, the tipwears such that after some initial period the nominal radius ofcurvature of the distal end ranges from 50 to 100 nm (or more), in oneembodiment. A voltage is applied across the media to form domains of low(or high) resistivity. The distal end of the tip is typically notcompletely flat, therefore the distal end is likely not in uniformcontact or near-contact with the phase change material (or theover-layer where present). The portion of the distal end in contact ornear-contact with the phase change layer is limited by the radius ofcurvature of the distal end. The portion of the tip in contact or nearcontact is also referred to herein as the terminus of the tip. It shouldbe noted that while the distal end is described as having a radius ofcurvature, the distal end need not be shaped so that the terminus liesalong a perfect arc. The radius of curvature can be thought of as anincrease in width of the distal end of the tip from the terminus, and asreferred to herein is not meant to be limited to geometries wherein adistal end includes a smooth, arced shape. The distal end can, forexample, have a parabolic shape, a trapezoidal shape, or a non-uniformshape. The tip is electrically conductive, and when a voltage potentialis applied between the tip and the media, current passes from the tip,through the over-layer and media to the underlying substrate (in thecase where the tip is a voltage source rather than a voltage sink). Thecurrent flowing between the media and tip varies across the radius ofcurvature as the electric field between the tip and the media decaysinversely with distance from the surface of the phase change layer.

The current passing from the tip to the media heats the phase changelayer near the tip. The phase change layer, the over-layer, the phasechange layer/over-layer interface and the tip/over-layer interface actas resistors. As the voltage potential across the media increases, thecurrent increases, and the temperature of the phase change layerincreases. FIG. 6 is a first order model of the heating characteristicsof an exemplary media as a voltage potential is applied across the mediain accordance with an embodiment of the present invention. The exemplarymedia includes a film stack comprising a titanium nitride over-layer 458deposited over a phase change layer 456. The heat generated by thecurrent can be distributed in a substantially parabolic fashion from thecontact or near contact point of the tip 542 and the media surface. Asmall portion of the media 450 near the surface of the film stack (thefirst isovolume 664) is heated above 780 K, and the material surroundingthe first isovolume 664 to the second isovolume 662 ranges from 780 K to500 K. The portion of the phase change layer 456 heated above about 575K, in one embodiment, becomes molten. If the bulk phase change layer 456is amorphous, the molten portion can be cooled slowly to form acrystalline structure having a relative resistivity orders of magnitudelower than a resistivity of the bulk phase change layer 456. If the bulkphase change layer 456 has a crystalline structure, the molten portioncan be quenched quickly, causing the molten portion to becomepredominantly amorphous and to have a relative resistivity orders ofmagnitude higher than the resistivity of the bulk phase change layer456. The temperature achieved during heating, and the coolingcharacteristics depend on the composition of the phase change layer 456,and can vary greatly.

As can be seen in FIG. 6, the portion of the phase change layer 456heated to a molten state, and thereafter properly cooled to form adomain having a resistivity substantially different than the bulkmaterial can be substantially small in width relative to the radius ofcurvature of the tip 542. For example, where methods in accordance withthe present invention are applied to create a voltage potential betweenthe phase change layer 456 and the tip 542, it has been demonstratedthat a tip 542 having an approximate radius of curvature ranging from 50nm to 100 nm can produce a domain having a width of approximately 15 nm.The domain can be said to be “super resolved.” Such super resolution canresult in part from properties of the over-layer, which can be ananisotropic columnar material (e.g., TiN, microcrystalline silicon) thatconducts better through the film rather than across the film. Thisproperty can focus electron flow near the center of the tip. Further, aportion of the phase change layer 456 near the center of the tip 542 isheated first, the portion consequently exhibiting lower resistance thanthe surrounding media, even the unheated crystalline material. Electronflow follows the lowest resistance, and thus the electron flow isfurther focused.

The amount of focusing of the current through the phase change layer456—and thus the size of the domain that results—can vary with thevoltage potential across the phase change layer 456 and the pressurebetween the tip 542 and the surface of the media. The voltage potentialcan determine the size of an air gap across which the current can arc,and current may or may not flow between the tip 542 and the phase changelayer 456 where an air gap exists (i.e. where the tip is not in directcontact with the media due to curvature). The pressure applied by thetip 542 against the surface can likewise affect the portion of the tip542 in direct contact with the surface and a size of the air gap wherethe tip curves away from the surface.

Once a domain has been defined within the phase change layer 456, theresistivity of the domain can be measured by applying a smaller voltagepotential across the portion of the media including the domain (e.g., inone embodiment less than 1 volt) and measuring the current through theportion. The small voltage potential drives a small current,insufficient to heat the portion to a crystallization or thresholdtemperature. Thus, the resistance (and resistivity) of the portionincluding the domain can be measured without substantially heating thephase change layer 456 and causing the electrical characteristics of thephase change layer 456 to be altered.

Methods and systems in accordance with embodiments of the presentinvention can be applied to form a plurality of bit cells comprising oneor more domains in a phase change layer 456. The plurality of bit cellscan be arranged in predefined proximity to one another and in any order,so long as a technique can be employed to locate a desired bit. Forexample, in one embodiment the bit cells can be arranged in rows. FIG.7A illustrates one embodiment of a method for forming and arranging bitcells. As shown, a “1” is represented by a domain having a highresistance. The bulk phase material 456 preferably has an initiallycrystalline structure. When a command is received to write a string ofbits, in this example “011011”, the tip 542 is moved across the mediasurface (from left to right in the figure) and moved within each bitcell to apply an appropriate current to form the desired value withinthe bit cell. The bulk phase change material 456 can have a nominal “0”or “1” state depending on the structure of the phase change layer andthe convention of indicating a “0” or “1”. Assuming, for this example,that a domain having a low resistance indicates a “0”, and that the bulkphase change material 456 is in a crystalline state, if the series ofbit cells have not been used to store data, each bit cell will have auniformly low resistance, indicating “0” values. However, more likelythe bit cells will have been used to store data.

To overwrite the bit cells, the tip 542 can perform overlap writing toensure that where a “0” is written the phase change material 456 issufficiently phase changed, which can allow the bit cells to bepositioned more closely together. In part, an overlap strategy forwriting a “0” can reduce concern that an insufficiently largecrystalline domain is formed. A write “0” voltage potential is typicallysmaller than a write “1” voltage potential, and when applied across themedia less current flows through the targeted portion of the mediadevice 450 (this can result also from a high resistance state of thephase change material). Thus, where overlap writing is not performed, aninsufficiently large domain can result because less phase changematerial is phase-changed. A read voltage applied to the tip 542 issmaller still than the “0” write voltage and has a narrow current path(relative to the domain), allowing a finer resolution during read(resulting, effectively, in a write wide/read narrow scheme).

Also, in part or in whole, overlap writing can be performed to improvecrystallization of a targeted portion of the phase change layer 456. Anamorphous domain has high resistance, causing current to follow anelectrical path around the edge of the amorphous domain. As a result,the amorphous domain is prevented from sufficiently heating, andcrystallization and erasure of the amorphous domain does not desirablyoccur. Such a result can be advantageously avoided by “dragging” the tip542 from an at least partially crystalline region and through theamorphous domain. The tip 542 can be arranged at the edge of theamorphous domain in the crystalline region and repositioned along a paththrough the amorphous domain while applying a voltage across the mediadevice 450. For example, in an embodiment a plurality of pulses can beapplied to the media device 450 as the tip 542 is repositioned from thecrystalline region across the amorphous domain. It is believed thatapplying a series of pulses perpetuates a heat wave front, therebyimproving crystallization of the amorphous domain. It is known thatstarting a crystallization process in an amorphous structure can requirean unacceptably long time delay before nucleation occurs andcrystallization subsequently follows. Such delay can be unacceptablewhere media surrounding the targeted domain is undesirably heated, orwhere write times are unacceptably long. Positioning the tip 542 over alocation where nucleation has been, or can easily be, achieved can allowcrystallization to occur more rapidly. Repositioning the tip 542 whileapplying a voltage across the media 450 can propagate nucleation sitesand/or the crystallized region within the phase change layer. Suchpropagation can be said to result from one or both of “pushing” the wavefront of crystallization away from the tip 542, effectively pushingcrystallization along ahead of the tip 542, or “pulling” the crystalstructure formed at nucleation sites through the amorphous domain alongwith the tip 542. It should be noted that other mechanisms may beinvolved in crystallizing the amorphous domain, and embodiments of thepresent invention are not meant to exclusively apply the mechanismdescribed herein. Rather, embodiments of the present invention are meantto capture all such methods wherein an amorphous domain is crystallizedby actively moving a tip 542 across the amorphous domain beginning froman at least partially crystallized region, while applying a voltagepotential across the media device 450. It should also be noted that inalternative embodiments of a method in accordance with the presentinvention, a plurality of pulses need not be applied across the mediadevice 450. For example, in some embodiments a constant voltagepotential can be applied to the media device 450 while the tip 542 isrepositioned. In still other embodiments, a waveform other than a pulsecan be applied to the media device 450 as the tip 542 is repositioned.For example, the waveform can be a ramp, a saw-tooth, a trailing edge,etc. One of ordinary skill in the art can appreciate the myriaddifferent methods of applying voltage to the media device 450 to heatthe media device 450 as the tip 542 moves over the surface of the mediadevice 450.

Referring to FIG. 7A, the tip moves across the surface continuously fromleft to right writing a “1” or a “0”. The write waveform plot indicatesan action of the tip as a function of tip position. For example, in bitcell N, a “0” is written in the first part of the bit cell tocrystallize any amorphous material. To write the “0”, a voltage isramped across the phase change layer to a first potential, heating thephase change layer proximate to the tip to at least the crystallizationtemperature. The voltage is ramped down, allowing the phase change layerto crystallize. The “0” is followed and overlapped by a “1”, written byramping the voltage to a second potential, higher than the firstpotential, heating the phase change layer proximate to the tip to atleast the threshold temperature. The voltage is removed so that themolten material is quenched to form a high resistance, amorphous domain.The tip then continues moving to the center of bit cell N+1, and againwrites a “1”. The tip then moves to bit cell N+2 and writes twoconsecutive “0” domains to ensure that the phase change layer in bitcell N+2 is crystallized, and a third consecutive “0” domain preceding a“1” written to bit cell N+3. The tip is then repositioned to bit cellN+4, where the final “1” is written.

The final written series of bits can be discerned in FIG. 7A from agrayscale pattern of resistance, with darker portions corresponding tohigher resistance and a gradient corresponding to a gradient ofresistance. Positioning the tip over a written bit and applying avoltage potential across the media can produce an analog resistancemeasurement correlated to a digital value. Referring to FIG. 7B, a tipapplying a low voltage potential between the tip and media can produceanalog read data of measured resistance as the tip moves along the mediasurface and over the bits. The digital equivalent, as read for exampleby a PRML channel interprets the string “011011”, with resistance peakscorresponding to “1” measurements. A media can be formatted or clearedby erasing all data written to the media, in a similar fashion asdescribed above. To wit, a string of overlapped “0” domains can bewritten by ramping the voltage to the first voltage and ramping down thevoltage to slowly cool the phase change layer, forming a crystallinestructure having low resistance, as shown in FIG. 7C.

Read/Write Circuitry

FIG. 8 is a circuit diagram of a read/write circuit 800 in accordancewith an embodiment of the present invention which can deliver an amountof power (or energy) to a passive media 450 to heat the media 450,thereby changing the phase of a portion of the media 450 from acrystalline state to an amorphous state (or vice-versa). As describedabove, the passive media 450 comprises a substrate and a film stackdeposited or grown over the substrate. The film stack can include aconductor layer contacting the substrate, a phase change layer, anover-layer to protect the phase change layer and tip(s) from damage. Atip 542 is placed in near or actual contact with the media surface whenreading and/or writing from the media surface. In an embodiment, one ofthe tip platform and the media platform is physically positioned belowthe other of the tip platform and the media platform so that the tips donot contact the media surface until current is applied to the actuatorsof the lower platform to create tension in the actuators and removeslack (such embodiments are loosely analogous to a hammock that hangsslack, but can be raised when the end ropes are placed in tension). Oncecurrent is passed through the positioning actuators of the lowerplatform, tension is produced in the pull-rods as the pull-rods aredrawn to the periphery of the cell. This causes the platform to rise upto meet an opposite platform, contacting tip 542 to media 450. By takingadvantage of passive non-contact between the tip platform and the mediaplatform, the complexity of read/write circuitry on a chip-wide scalecan be reduced, as well as the complexity of chip packaging (as isdescribed in more detail below). The addressing scheme can be connectedwith multiple platforms, yet can address one platform at a time bycompleting a circuit between tip and media platforms.

In still other embodiments, as will be discussed in more detail, theplatform can be positioned such that the cantilevers continuouslycontact the media surface. With the tip platform in near or actualcontact, a tip 542 is selected from the tip platform and activated sothat current flows through the tip 542. Where all tips of a platformcontinuously contact a media surface, it can be advantageous to applycurrent through one of a plurality of tips mounted to the platform.Applying current through multiple tips from a single platform during awrite operation, for example, can cause unintended bits to be written orerased. However, the invention is equally applicable to platformswherein multiple tips can be accessed at a single time.

The activated tip 542 allows current to flow, completing a circuitbetween a voltage source and the grounded passive media 450. A WRITEsignal S6 selectively sets a switch 812 completing the circuit witheither a read voltage source which is defined by a read voltagedigital/analog converter (DAC) 802, or a write ramp generator 806.Current passes through the circuit and through the passive media 450 ata rate determined by the voltage potential between the voltage sourceand the grounded passive media 450. A sense resistor 816 is placed inseries with the completed circuit between two inputs connected with afirst amplifier 818. The first amplifier 818 measures a drop in voltageacross the sense resistor 816 and outputs a current measurement to apower calculator 822. A second amplifier 820 measures the voltage dropacross the passive media. The output of the second amplifier 820 is fedto both the power calculator and an analog read data channel, such asfor example a PRML channel. The two amplifiers together canapproximately measure the voltage and current through the passive media.The power calculator 822, in one embodiment a high bandwidth multiplier,calculates the product of the tip current and the tip voltage todetermine the power applied to the passive media 450. The product of thecurrent and the tip voltage is further multiplied by a constant, K, andthe output is supplied as input to a power comparator 826, along with apower reference signal 824 (i.e., a threshold set by a digital to analogconverter, or other means). The power reference signal 824 is determinedbased on prior knowledge of the media phase change characteristics. Thecomparator 826 compares the output of the power calculator 822 to thepower reference signal 824 and outputs a digital signal to a flip-flopcircuit 828. In other embodiments, a desired energy, voltage or currentcan be targeted. To determine the energy across the circuit, the outputof the calculator is provided to a resetable integrator, the output ofwhich is applied to the comparator.

The flip-flop circuit 828 can be a standard bistable flip-flop circuitwith “set”, “reset” and “clear” inputs and a digital output. Forexample, in one embodiment the flip-flop 828 can be a commerciallyavailable flip-flop circuit, such as an SN7474 circuit. If a pulse isprovided to the set input, the flip-flop 828 will be “1” at its output,and if a pulse is provided to the reset input, the flip-flop 828 will be“0” at its output. The flip-flop 828 will ignore all input in a clearstate. The clear input is a false term input. The WRITE signal S6selectively activates a switch setting the voltage source to be eitherthe write ramp generator 806 or the read voltage source 802. When aWRITE signal S6 is false—i.e., the circuit is performing a read—then theflip-flop 828 is in a clear state and the output is “0”. When the WRITEsignal S6 is true the switch configures the circuit in series with thewrite ramp generator 806, and the flip-flop 828 is no longer in a clearstate. The WRITE CLOCK signal S2 defines the bit cell time and sets theflip-flop 828, initiating the circuit to write. The flip-flop 828outputs to the write ramp generator 806 and causes the write rampgenerator 806 to generate a waveform for writing. The maximum voltage ofthe write ramp generator 806 is limited by a WRITE Vmax DAC 808. Whenthe calculated power through the passive media 450 exceeds the powerreference signal 824, the comparator 826 outputs a “1” to the flip-flop828, triggering the flip-flop 828 to reset.

The digital output of the flip-flop 828 is sent to a one-shot timer 830as a clock input. The one-shot timer 830 is a standard circuit having“clock input”, “enable” and “clear” inputs. The one-shot timer 830 canbe a commercially available circuit, such as an SN74123 circuit. If aWRITE DATA signal S4 is false, then the one-shot timer output is “0”,and the clock input is ignored. The clear input is a false term input,as is the clear input for the flip-flop circuit, and when the WRITEsignal S6 is true the one-shot timer 830 is no longer in a clear state.Both the WRITE DATA signal S4 and WRITE signal S6 must be true to enablethe one-shot timer 830.

When both the WRITE signal S6 and the WRITE DATA signal S4 are true, thevoltage source switch is set so that the write ramp generator 806 is inseries with a write current limiting resistor 812, the sense resistor816, and the grounded passive media 450. The active tip 542 can bepositioned or moved over the media surface, without drawing significantcurrent. To write a bit, the WRITE CLOCK signal S2 is pulsed, causingthe flip-flop 828 to set, outputting a “1” to the one-shot timer 830 andthe write ramp generator 810. The write ramp generator 810 ramps thewrite voltage starting from 0 volts. Ramping the write voltage providesan advantage in controlling the power delivered to the media. Forexample, ramping can compensate for stray capacitance resulting from astep in sensed current due to the product of the capacitance and thetime integral of voltage. The step in sensed current can be calibratedfor by adding an offset to the current sense amplifier 818,820. Anotheradvantage of ramping is that the current sense amplifiers 818,820 havelower bandwidths since the power is changing at the ramp rate, resultingin smaller errors in power calculation and consequently in resetting theflip-flop 828 when the power exceeds the power reference signal 824. Inother embodiments, the maximum and minimum voltage, and the ramp ratecan vary. Note that ramping is not required. In other embodiments thewrite voltage can be pulsed across the circuit. Similarly, the wave formproduced by the wave form generators can vary. For example, the waveformcan be triangular or saw-tooth.

As the voltage increases, the current increases and the passive media450 begins to heat. The calculated power increases, and at some time t,the calculated power is equal to the power reference signal 824. Whenthe power reference signal 824 is reached, the power comparator sends apulse resetting the flip-flop circuit 828. The flip-flop 828 sends asignal ramping down the write ramp generator 806 and opening a switch814 between the write ramp generator 806 and the write limit resistor810, and provides a pulse as clock input to the one-shot timer 830. Theone-shot timer 830, enabled by the true value of the WRITE DATA signalS4 and WRITE signal S6, sends a signal activating a clamp 834, which inone embodiment can be a high speed analog switch having a turn off timeon the order of 10 ns. The clamp 834 short-circuits the voltage sourceto the tip 542 through the conductive layer of the passive media 450.With the tip voltage source shorted, current no longer flows through thephase change layer 456, but rather through the grounded conductor layer.The substrate draws heat away from the phase change layer via theconductor, quenching the phase change layer. The speed with which thepassive media 450 cools leaves the phase bit in a high resistanceamorphous state, thus creating a “1”. As described above, in anamorphous state a phase change material does not have free carriers,causing resistance to increase by as much as 1000:1 ratio. Clamping thecircuit can decrease cooling time from, in an embodiment, approximately200 ns to under 5 ns.

When the WRITE signal S6 is “1” and the WRITE DATA signal S4 is “0”, thecircuit is configured to erase or write a “0”. When the WRITE CLOCKsignal S2 provides a pulse and sets the flip-flop 828, the flip-flop 828sends a “1” output signal to the one-shot timer 830 and the wave rampgenerator 806. The wave ramp generator 806 increases the voltage acrossthe passive media 450 and the sense resistor 816 and the write currentlimiting resistor 810. The current begins to increase and the passivemedia 450 begins to heat. Erasing a previously written “1” requires thatthe phase change layer be heated well into the media's “dynamic onstate,” and then slowly cooled to form a crystalline state having lowresistance. FIG. 5 is a chart illustrating the characteristics of achalcogenide media device. As can be seen, the voltage ramped across anamorphous region of a chalcogenide must exceed a threshold voltagebefore the amorphous region can cooled to form crystalline structure. Asthe current increases, the calculated power increases, and at some timet2, the calculated power is equal to the power reference signal 824.When the power reference signal 824 no longer exceeds the power appliedto the passive media 450, the power comparator 826 sends a pulseresetting the flip-flop 828. The flip-flop 828 sends a signal rampingdown the write ramp generator 806 and provides a pulse as clock input tothe one-shot circuit 830. The output of the one-shot circuit 830,disabled by the false value of the WRITE DATA signal S4, continues to be“0”. As the phase change layer region cools—more slowly with the clampremaining open absent a pulse from the one-shot circuit output—theheated medium crystallizes, creating a “0”.

When the WRITE signal S6 is false, the flip-flop 828 is in a clearstate, ignoring all inputs. The mode switch 812 configures the circuitso that the read voltage source 802 is in series with a read limitingresistor 804, the sense resistor 816, and the grounded, passive media450. The voltage across the passive media 450 draws a relatively smallamount of current, insufficient to change the material properties of thephase change layer, but sufficient to allow the second amplifier 820 tomeasure the voltage drop across the passive media 450 and send theoutput as ANALOG READ DATA signal 832 to a read circuit (not shown). Inan embodiment, the read voltage is approximately 1 volt or less, actingas a current source with a voltage ceiling. Reading the media at lowervoltages can limit a “tunneling effect” to a smaller tip region close tothe media and can provide better resolution. In other embodiments theread voltage can be higher than 1 volt. Where the phase change layer isamorphous, the resistivity of the phase change layer is higher (i.e., insome embodiments four orders of magnitude (104) higher than thecrystalline material) resulting in a larger, detectable voltage dropbetween the voltage source and the passive media 450. Where the phasechange layer is crystalline, the resistivity of the phase change layeris lower.

FIG. 9 is a circuit diagram of an alternative embodiment of a circuit inaccordance with the present invention. The circuit includes separatewave form generators and write power reference signals for writing “1” sand “0” s. The WRITE DATA signal S4 further selectively configures thewrite power reference and wave form generator. When the WRITE DATAsignal S4 and the WRITE signal S6 are “1”, a wave form generatorselector switch and the mode switch 812 configure the circuit in serieswith the write “1” wave form generator 906, and a power referenceselection switch 924 configures the comparator 826 to receive a write 1power reference signal 924. When the WRITE CLOCK signal S2 is “1”, apulse is sent setting the flip-flop circuit 828. The flip-flop 828 sendsa “1” output signal to the one-shot timer 830 and the write 1 wave formgenerator 906. The write “1” wave form generator 906 increases thevoltage across the passive media 450 and the sense resistor 816 and thewrite 1 current limiting resistor 910. As the current increases thephase change layer begins to heat. The power calculated by the powercalculator 822 increases, and at some time t, the calculated power isequal to the write “1” power reference signal 924. When the powerreference 924 no longer exceeds the power applied to the passive media450, the power comparator 826 sends a pulse resetting the flip-flop 828.The flip-flop sends a signal ramping down the write “1” wave formgenerator and provides a pulse as clock input to the one-shot circuit.The one-shot circuit, enabled by the true value of the WRITE DATA signalS4 and WRITE signal S6, sends a signal activating a clamp 834 whichshort circuits the voltage source to the tips through the circuit. Byshorting the tip voltage source, current no longer flows through thepassive media 450, and the phase change layer quickly cools. The speedwith which the phase change layer cools leaves the phase bit in anamorphous state, thus creating a “1”. Note that for circuits of FIGS.9-12, as with FIG. 8, ramping is not required. In other embodiments thevoltage can be pulsed across the circuit. Similarly, the wave formproduced by he wave form generators can vary. For example, the waveformcan be triangular or saw-tooth.

When the WRITE signal is “1” and the WRITE DATA input signal S4 is “0”,the circuit is configured so that the write “0” wave form generator 940is in series with a write 0 current limiting resistor 944, the passivemedia 450, and the tip 542. When the WRITE CLOCK signal S2 provides apulse and sets the flip-flop 828, the flip-flop circuit sends a “1”output signal to the one-shot timer and the wave form generators. Thewrite 0 wave form generator increases the voltage across the media andthe sense resistor 816 and the write 0 current limiting resistor 944. Inone embodiment, the write 0 wave form generator can be a higher voltagesource than the write 1 wave form generator, creating a larger voltagepotential across the circuit and increasing current. As the currentincreases the passive media 450 begins to heat. When the phase changelayer is in a high resistance state (i.e., an amorphous state), thevoltage across the phase change layer must exceed a threshold voltage,whereby the phase change layer enters a negative resistance mode, asshown in FIG. 5. The resistance of the phase change layer continues tochange as it heats. When the phase change layer reaches a semi-moltenstate, the voltage current curve merges with the voltage-current curveof the low resistance, crystalline material (once the material issemi-molten or molten, the phase change layer is neither crystalline oramorphous). The calculated power increases as the voltage and currentincrease, and at some time t2, the calculated power is equal to thewrite 0 power reference 946. When the power reference signal 946 nolonger exceeds the power applied to the passive media 450, the powercomparator 826 sends a pulse resetting the flip-flop 828. The flip-flop828 sends a signal slowly ramping down the write “0” wave form generator940 and provides a pulse as clock input to the one-shot circuit 830. Theoutput of the one-shot circuit 830, disabled by the false value of theWRITE DATA signal S4, continues to be “0”. As the phase change layerslowly cools, the heated medium crystallizes, creating a “0”. Whenwriting a “0”, a lower power reference is used, and once the power levelis reached the voltage is ramped down slowly so that the media still haspower in a diminishing amount with time, allowing the phase change layerto cool at a sufficiently slow rate to crystallize.

As in the previous embodiment, when the WRITE signal S6 is false theflip-flop 828 is in a clear state, ignoring all inputs. The mode switch812 configures the circuit so that the read voltage source 802 is inseries with a read limiting resistor 804, the sense resistor 816, andthe grounded, passive media 450. The voltage across the passive media450 draws a relatively small amount of current, insufficient to changethe material properties of the phase change layer, but sufficient toallow the second amplifier 820 to measure the voltage drop across thepassive media 450 and send the output as ANALOG READ DATA signal 832 toa read circuit (not shown). The read voltage should be sufficiently lowsuch that the portion through which the voltage is applied does notundergo a phase change as a result of the application of the voltage. Inan embodiment, the read voltage is typically less than 1 volt, acting asa current source with a voltage ceiling (the read voltage can vary withstack composition of the media device 450, and generally can be lessthan 0.8 volts across the chalcogenide material). Reading the media atlower voltages can limit a “tunneling effect” to a smaller tip regionclose to the media and can provide better resolution. In otherembodiments the read voltage can be higher than 1 volt. Where the phasechange layer is amorphous, the resistivity of the phase change layer ishigher (i.e., in some embodiments on the order of four orders ofmagnitude higher than the crystalline material) resulting in a larger,detectable voltage drop between the voltage source and the passive media450. Where the phase change layer is crystalline, the resistivity of thephase change layer is lower.

FIG. 10 is a circuit diagram of still another embodiment of a circuit inaccordance with the present invention. In such an embodiment, theread/write circuitry is associated with the media platform and passivetips 442 provide a ground path for current flowing through the circuit1000. The media is “active” rather than “passive” and media islands areisolated from one another, as shown in the media cell of FIG. 3. Themedia regions can be isolated from one another by insulating regionsusing standard semiconductor processing techniques (e.g., trench etchand deposition, etc.). Use of active media regions allows all tips to beconnected in common, thus potentially reducing the number of leadsnecessary to the tip platforms. As described below, use of active mediaregions also permits platform bussing, and thus further reductions ininterconnects and read/write circuitry. The active media 1050 comprisesa film stack including an insulator deposited or grown on the substrate,a conductor, a phase change layer, and optionally an over-layer grown ordeposited on the insulator. The conductor, phase change layer, andover-layer (where present) are isolated media regions, electricallyconnected to the media platform read/write circuitry (e.g., by etchingcontacts or vias prior to forming the conductive layer). The read/writecircuitry can selectively activate a media region, for example by atransmission gate, completing a circuit between a voltage source and apassive tip 442 in contact or near contact with the media. Theread/write circuitry is arranged, for example, as described in FIGS. 8and 9, however when the one-shot timer 830 activates the clamp, anelectrical path is formed between the voltage source and the groundedtip platform and stored charge is drawn sharply from the phase changelayer through the conductor and to the substrate. This allows the mediato cool rapidly through conduction and convection and leaves the regionin an amorphous state.

The circuit diagrams illustrated and described above are exemplary andcan include myriad different variations. The scope of the presentinvention is not intended to be limited to exemplary circuits describedherein. For example, FIG. 11 is a circuit diagram of a circuit inaccordance with still another embodiment, the circuit including anactive media and read/write circuitry associated with the mediaplatform, as described in reference to FIG. 10; however, a voltage iscommonly applied to tips connected with one or more platforms. In thisembodiment the write wave form generators 940, 906 and the read voltageDAC sink rather than source the current. When the clamp is applied thetip is directly shorted to the media substrate.

In still more embodiments, the circuit can be simplified by integratingportions of the circuit into a single processing element, for examplesuch as application specific integrated circuit (ASIC), and enabling anadaptive feedback circuit (rather than an open loop circuit, asdescribed above). FIG. 12 illustrates such an embodiment, wherein apower calculator, comparator, flip-flop circuit, and one-shot timer canbe integrated into a single processing element. A WRITE signal canconfigure the circuit such that a write wave form generator 806 is inseries with a write current limiting resistor 810, an active mediaregion 1050, and a tip 542. A WRITE DATA signal S4 is received by theprocessing element 1252, which configures the write wave form generator806 to apply an increase in voltage in accordance with an action of thecircuit. When the processing element 1252 determines that sufficientpower (or energy) has been applied to achieve a phase change in thephase change layer 450, the processing element provides an output signalto a clamp 834 to short circuit the active media region 1050. Theprocessing element 1252 can constantly monitor the resistance of thephase change layer 450 and adjust the write waveform and power levels.Should a bit cell already contain a data bit equivalent to the one to bewritten, the processing element 1252 could optionally not initiate anycurrent flow through the tip for that bit cell.

In one embodiment, the processing element can be a very fast processorthat, for example, performs a table lookup and generates a writewaveform that is a function of the voltage across the media tip or thecurrent through the tip, rather than generating a fixed wave form forwriting a “1” or a “0”. The processor could apply a complex transferfunction. The phase change layer is described in simple, uniform termsabove, however, the phase change layer characteristics can vary acrossthe film with grain boundary regions, nonuniformity, etc. By generatinga write waveform that is a function of the characteristics of the media,the processor provides the ability to read the current voltage orresistance before writing so that the write waveform generated is suitedto the state of the media prior to writing. Further, the write waveformcan be modified during the write depending on what it experiences. Theprocessor can measure the effectiveness of the write afterwards andmemorize a running history of how the active media region measures sothat, for example, the tip can attempt to write to a portion of themedia with a given set of characteristics. If the desired results arenot achieved, the process can be reiterative, with the processingelement modifying current, and/or wave shapes in order to optimize thefinal result. Such a circuit is adaptive to characteristics of the mediaand/or a tip, and can be particularly beneficial where suchcharacteristics include a great deal of variability.

Active Media Region Selection/Interconnect Reduction

FIG. 13 is a circuit diagram of an exemplary media platform inaccordance with one embodiment of the present invention. The exemplarymedia platform comprises 64 active media regions. Each active mediaregion is associated with a corresponding tip from a tip platform, thecorresponding tip being positionable within the active media region byactuating one or both of the media and tip platform. The active mediaregion can be sized, in one embodiment, as a 100μm×100μm square. If thetip is capable of writing a 20 nm bit, the active media region iscapable of storing 25×10⁶ bits—i.e., approximately 3 MB —packedside-by-side. A portion of each active media region can be dedicated toservos, headers and gap, for example 10%. The tip platform can rely onclocking and a servo scheme, for example as known in the art, toposition a tip over a desired bit.

The active media regions of the exemplary platform are each associatedwith one of 16 bit-lines 1372 and one of four banks 1370. Each bit-line1372 is associated with a read/write circuit, and is connected with theexemplary platform when a transmission gate 836 is closed and the mediaplatform is active. The transmission gate controls the current source orthe ground plane underneath each media region. This is made possible bya discontinuous ground plane. Rather than using a common ground plane,for example as in the embodiment illustrated in FIG. 8 and 9, the groundplane is selectably activated. Each bank 1370 is associated with oneactive media region from each of the 16 bit-lines 1372. As can be seenin FIG. 1, a die having interconnect nodes 102 for each required signalcan become extremely dense with wiring. As can be seen, each platform ofthe exemplary die includes sixteen tips. Each tip is individuallyaddressed, therefore each platform includes sixteen wires. Further, eachactuator includes a dual wire ground created eight additional wires foreach platform. In a die 100 having sixteen platform, this results in 384separate interconnect nodes 102 in an approximately 10 mm space and/or384 separate read/write circuits —a complicated package and/or chip tomanufacture. The problem is exacerbated with platforms having 64 tips,and 1152 interconnects are required for a sixteen cell die.

Methods and systems in accordance with the present invention cancomprise selectable banks 1370 for accessing groups of (or individual)tips. The banks 1370 can reduce the complexity of read/write circuitry,and the number of interconnects between the platform and the read/writecircuitry by activating only one of the active media regions for eachbit-line. A supervisor processor controls the memory system and providesa signal to one of the banks 1370 closing the media region select switch(i.e., the transmission gate) 836 associated with a corresponding activemedia region for each of the bit-lines 1372, completing the circuitbetween the bit-line 1372 and the active-media region, as describedabove in reference to FIG. 10-12. The transmission gates 836 thus allowelectronic tip selection by controlling the current flow or the groundplane beneath the media region. The tips can be connected with a commonvoltage source or sinked to a common ground, reducing the complexity ofthe read/write engine (the die comprising tip platforms). Thetransmission gates 836 can be formed, for example, beneath the mediaregions on the media die.

FIG. 14 is a circuit diagram of a single memory chip comprising 16platforms. Each media platform is connected with the 16 bit-lines, butonly one platform is active at a time. The active platform is activatedby a decoder (i.e., a multiplexer or demultiplexer) that receives inputfrom four platform select bits, and selects the appropriate mediaplatform. A plurality of chips can be bussed (connected in common withthe 16 bit-lines) and controlled by a single supervisor processor.Further, the bank select and platform select signals from the supervisorprocessor can be bussed, so that only a corresponding chip select signalneed by uniquely routed to each chip. Thus, the supervisor processor canselect the bank and platform, and select the chip to determine which ofthe 16 tips from which to receive data. Further, signals from thesupervisor processor are sent to the platform to position the mediaplatform relative to the tip platform, thereby selecting a desired bitwithin the active media region. Each exemplary chip includes 16platforms having four actuators, therefore each exemplary chip includes64 actuators. The actuators signals are multiplexed, and based on thebank and platform select signals.

FIG. 15 is a circuit diagram of an alternative embodiment of a mediaplatform in accordance with the present invention. Each active mediaregion includes an insulated portion, or dead spot isolation region. Thedead spots can be formed in the film stack of the active media usingdifferent techniques. For example, the dead spot can be formed bypartially etching the film stack, filling the etched portion with anoxide, and polishing the film stack using chemical-mechanical polishing(CMP). Alternatively, nitride can be deposited on the film stack, aportion of the film stack can be etched to form dead spots, a thermaloxide can be grown in the etched portions, and the nitride can bestripped. Myriad different manufacturing techniques can be applied toform an insulated isolation region within or on a conductive material.One of ordinary skill in the art can appreciate the different methodsfor forming features in a film stack. In one embodiment, the dead spotis an indentation in the film stack surface, such that a tip rests inthe spot. The tip can rest in the shallow depression until the actuatorsof an associated tip platform (or a corresponding media platform) areactivated. A platform positioned such that the tips rest in dead spotsin the active media region is isolated from the bit-lines, therefore aplatform select signal is not required, and the circuitry is simplified.The actuator signals are separately controlled, and either the mediaplatform or the tip platform is controlled. When the platform isrepositioned off-center a circuit is completed between the tip and thebit-line.

Each insulated portion can be a relative small portion within the activemedia region. The insulated portion is sized according to manufacturingtolerances of the platforms and/or tips, thermal expansion of eachplatform relative to one another, etc., and in one embodiment cancomprise a 5 μm×5 μm square. An isolation region of that size within a100 μm×100 μm active media region consumes only 0.25% of the activemedia region surface.

FIG. 16 is a circuit diagram of an alternative embodiment of a singlememory chip comprising 16 platforms, with each platform including activemedia regions having dead spots. Only one platform is active at a time,because only one platform is positioned off of the dead spot. Thedecoder of FIG. 14 and the chip select signal is no longer required. Aplurality of chips can be bussed, connecting the 16 bit-lines and bankselect signals in common. Further, the bank select and platform selectsignals from the supervisor processor can be bussed, so that only acorresponding chip select signal need by uniquely routed to each chip.Thus, the supervisor processor can select the bank and platform, andselect the chip to determine which of the 16 tips from which to receivedata. Further, signals from the supervisor processor are sent to theplatform to position the media platform relative to the tip platform,thereby selecting a desired bit within the active media region. Eachexemplary chip includes 16 platforms having four actuators, thereforeeach exemplary chip includes 64 actuators. The actuators signals aremultiplexed, and based on the bank and platform select signals.

The foregoing description of the present invention have been presentedfor purposes of illustration and description. It is not intended to beexhaustive or to limit the invention to the precise forms disclosed.Many modifications and variations will be apparent to practitionersskilled in this art. The embodiments were chosen and described in orderto best explain the principles of the invention and its practicalapplication, thereby enabling others skilled in the art to understandthe invention for various embodiments and with various modifications asare suited to the particular use contemplated. It is intended that thescope of the invention be defined by the following claims and theirequivalents.

1. A data storage device comprising: a media including: a memory layerwithin which are formable domains associated with information, and aconductive layer disposed over the memory layer, the conductive layerhaving anisotropically increased electrical conductivity in a thicknessdirection; and a conductive tip contactable with the conductive layer,one of the conductive tip and the media being movable so that a portionof the memory layer electrically accessible to the conductive tip isvariable.
 2. The data storage device of claim 1, wherein the memorylayer comprises phase change material.
 3. The data storage device ofclaim 1, wherein the memory layer comprises a charge-storage media. 4.The data storage device of claim 1, wherein the conductive layercomprises titanium nitride.
 5. The data storage device of claim 1,wherein the conductive layer is free of patterned features.
 6. The datastorage device of claim 1, further comprising a plurality of conductivetips spaced apart from one another and adapted to access a plurality ofdomains.
 7. The data storage device of claim 5, wherein the conductivetips are arranged in an array.
 8. A data storage device comprising: amedia including: a memory layer within which are formable domainsassociated with information, and a conductive layer disposed over thememory layer, the conductive layer comprising an anisotropic columnarmaterial having higher electrical conductivity through the conductivelayer than across the conductive layer; and a conductive tip contactablewith the conductive layer, one of the conductive tip and the media beingmovable so that the conductive tip is selectively in electricalcommunication with one of the formable domains.
 9. The data storagedevice of claim 8, wherein the memory layer comprises phase changematerial.
 10. The data storage device of claim 8, wherein the memorylayer comprises a charge-storage media.
 11. The data storage device ofclaim 8, wherein the conductive layer comprises titanium nitride. 12.The data storage device of claim 8, wherein the conductive layer is freeof patterned features.
 13. The data storage device of claim 8, furthercomprising a plurality of conductive tips spaced apart from one anotherand adapted to access the formable domains.
 14. The data storage deviceof claim 13, wherein the conductive tips are arranged in an array.